Product Specifications
|
Item |
Specification |
|
Product Series |
A1201 / ACH Compatible |
|
Connector Type |
Wire-to-Board Connector |
|
Pitch |
1.20mm |
|
Rated Current |
1.5–2A AC/DC |
|
Rated Voltage |
50V DC |
|
Withstand Voltage |
500V AC/minute |
|
Operating Temperature |
-40°C to +105°C |
|
Contact Resistance |
20mΩ Max. |
|
Insulation Resistance |
100MΩ Min. |
|
Housing Material |
PA66, UL94V-0, White |
|
Terminal Material |
Gold-Plated Phosphor Copper |
|
SMT Pin Body Material |
PA46, UL94V-0, Natural Color |
|
PIN Material |
Gold-Plated Phosphor Copper |
|
Pin Holder Ground Disc Material |
Brass, Tin-Plated |
Key Features
1.20mm pitch supports compact wire-to-board connections for PCB assemblies with limited connector space.
Gold-plated phosphor copper terminals and pins are used for the specified electrical contact performance.
The PA66 UL94V-0 housing and PA46 UL94V-0 SMT pin body provide flame-retardant materials for the connector assembly.
Housing, terminals and PCB wafers or headers can be supplied separately or as matching component sets.
Product Available Components
Reel and loose-piece gold-plated phosphor copper contacts for automated and manual wire harness processing.
1.20mm pitch plastic housings available in different circuit configurations to match the required harness configuration.
Straight (DIP) and Right-Angle (SMT) pin headers with brass, tin-plated ground discs for PCB retention and shielding.
Compatible Applications
Consumer Electronics: Internal power and signal connections in compact electronic devices and PCB assemblies.
Smart Home Hardware: Wire-to-board connections in sensor modules, IoT controllers, and lighting control boards.
Industrial Controls: Internal connections in instrumentation, embedded control systems, and compact control boards.
Customization Options
Circuit & Pin Configuration:
Wafer and header circuit counts, pin layouts and orientations can be reviewed according to the PCB layout and mating housing.
PCB Mounting & Plating:
SMT or DIP mounting configurations and contact plating options can be reviewed according to assembly and electrical requirements.
Packaging:
Packaging formats can be arranged by component type and assembly process, including reel packaging where applicable.
Mating Configuration
Pin-to-Socket Alignment: Molded guide ribs help control mating orientation and reduce incorrect insertion during harness assembly.
Retention Force: Mating and unmating forces are designed for stable connection and disconnection during normal use.
Harness Compatibility: Designed for wire harness assemblies using matching A1201 crimp terminals and compatible 1.20mm pitch components.
Quality Control Process
Incoming inspection covers base metals, phosphor copper, and engineering plastics (PA66/PA46) according to material and production requirements.
Dimensional inspection covers pitch accuracy, pin coplanarity, and key housing dimensions during production.
Testing covers contact resistance, dielectric withstand voltage, and applicable environmental performance according to product requirements.
Factory Strength
Production Capacity: Injection molding and automated stamping support production of connector housings, terminals, and PCB-side components for volume orders.
Tooling & R&D: Engineering support covers mold development, prototyping, and connector configuration review before production.
Compliance: Quality management follows applicable ISO requirements, with RoHS and REACH compliance documentation available for export orders.
Manufacturing Capability
Precision Tooling: Connector mold design, precision mold manufacturing and mold maintenance are handled for 1.20 mm-pitch housing and wafer components.
Precision Stamping: Phosphor copper terminals are stamped and formed in controlled tooling for consistent contact and crimp geometry.
Injection Molding: PA66 housings and PA46 PCB-side components are produced through dedicated injection molding processes.
Terminal Plating: Contact terminals and pins are processed with specified gold plating to meet the required contact configuration.
Automated Assembly: Connector components can be assembled through controlled production lines for consistent positioning and repeat-order requirements.
After-sales Service
Technical Documentation: 2D/3D CAD drawings, electrical specification sheets, and RoHS/REACH compliance documents can be provided upon request.
Issue Review: Reported product issues can be reviewed against order and batch information to identify the relevant production details.
Quality Resolution: Confirmed quality issues are handled according to the agreed commercial and quality terms.
Repeat Order: Previous specifications and approved configurations can be referenced for repeat production, subject to order confirmation.
FAQ
Q: Can you provide samples before a bulk order?
A: Yes. Samples can be arranged for dimensional, mating, and assembly evaluation before production.
Q: Can I purchase the housing, terminal, and wafer separately?
A: Yes. Individual components can be quoted separately when the required part numbers and quantities are specified.
Q: Can you identify the matching components if we only have a sample?
A: A physical sample can be reviewed to help identify the corresponding housing, terminal, and PCB-side component configuration.
Q: Can you work with customer-supplied connector drawings?
A: Yes. Customer drawings can be reviewed for manufacturability, dimensional requirements, and configuration before quotation or sample development.
Q: Can packaging be discussed for different order quantities?
A: Yes. Packaging arrangements can be reviewed according to component type, order quantity, transportation, and receiving requirements.
Q: Can you support repeat procurement based on a previous sample?
A: Yes. An approved sample or previous order reference can be used to confirm the required configuration before repeat production.
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