Key Specifications
|
Parameter |
Specification |
|
Product Type |
SMD Right-Angle Header |
|
Pitch |
0.60mm (0.0236 in) |
|
Connector Type |
Wire-to-Board |
|
Mounting Type |
Surface Mount (SMT) |
|
Orientation |
Right-Angle |
|
Number of Rows |
Single Row |
|
Available Circuits |
2, 3, 4, 5, 6, 7, 8, 9, 10, 12, 14, 15, 16 |
|
Rated Current |
0.2A AC/DC |
|
Rated Voltage |
30V DC |
|
Operating Temperature |
-40°C to +105°C |
|
Contact Resistance |
30mΩ Max. |
|
Insulation Resistance |
100MΩ Min. |
|
Withstanding Voltage |
200V AC for 1 Minute |
|
Housing Material |
LCP, UL94V-0, Black |
|
Terminal Material |
Phosphor Copper |
|
Contact Finish |
Gold (Au) Plating |
|
Pin Material |
Phosphor Copper |
|
Pin Plating |
Tin and Gold Plating |
|
Grounding Tab Material |
Phosphor Copper |
|
Grounding Tab Finish |
Tin Plating |
JST Equivalent / Replacement Models
| Brand | Model A | Model B | Model C | Model D | CSG Model | Description |
| JST | 02XSR-36S | 2XSR-36S | A0600HI002AALPGF0182 | A0600HI002AALPGF0187 | 0.60mm(.0236in)Pitch,Receptacle IDC Connectors,Socket,2 Circuits,Gold(Au) Plating,UL 94V-0,Black | |
| JST | 03XSR-36S | 3XSR-36S | A0600HI003AALPGF0182 | A0600HI003AALPGF0187 | 0.60mm(.0236in)Pitch,Receptacle IDC Connectors,Socket,3 Circuits,Gold(Au) Plating,UL 94V-0,Black | |
| JST | 04XSR-36S | 4XSR-36S | A0600HI004AALPGF0182 | A0600HI004AALPGF0187 | 0.60mm(.0236in)Pitch,Receptacle IDC Connectors,Socket,4 Circuits,Gold(Au) Plating,UL 94V-0,Black | |
| JST | 05XSR-36S | 5XSR-36S | A0600HI005AALPGF0182 | A0600HI005AALPGF0187 | 0.60mm(.0236in)Pitch,Receptacle IDC Connectors,Socket,5 Circuits,Gold(Au) Plating,UL 94V-0,Black | |
| JST | 06XSR-36S | 6XSR-36S | A0600HI006AALPGF0182 | A0600HI006AALPGF0187 | 0.60mm(.0236in)Pitch,Receptacle IDC Connectors,Socket,6 Circuits,Gold(Au) Plating,UL 94V-0,Black | |
| JST | 07XSR-36S | 7XSR-36S | A0600HI007AALPGF0182 | A0600HI007AALPGF0187 | 0.60mm(.0236in)Pitch,Receptacle IDC Connectors,Socket,7 Circuits,Gold(Au) Plating,UL 94V-0,Black | |
| JST | 08XSR-36S | 8XSR-36S | A0600HI008AALPGF0182 | A0600HI008AALPGF0187 | 0.60mm(.0236in)Pitch,Receptacle IDC Connectors,Socket,8 Circuits,Gold(Au) Plating,UL 94V-0,Black | |
| JST | 09XSR-36S | 9XSR-36S | A0600HI009AALPGF0182 | A0600HI009AALPGF0187 | 0.60mm(.0236in)Pitch,Receptacle IDC Connectors,Socket,9 Circuits,Gold(Au) Plating,UL 94V-0,Black | |
| JST | 10XSR-36S | A0600HI010AALPGF0182 | A0600HI010AALPGF0187 | 0.60mm(.0236in)Pitch,Receptacle IDC Connectors,Socket,10 Circuits,Gold(Au) Plating,UL 94V-0,Black | ||
| JST | 12XSR-36S | A0600HI012AALPGF0182 | A0600HI012AALPGF0187 | 0.60mm(.0236in)Pitch,Receptacle IDC Connectors,Socket,12 Circuits,Gold(Au) Plating,UL 94V-0,Black | ||
| JST | 14XSR-36S | A0600HI014AALPGF0182 | A0600HI014AALPGF0187 | 0.60mm(.0236in)Pitch,Receptacle IDC Connectors,Socket,14 Circuits,Gold(Au) Plating,UL 94V-0,Black | ||
| JST | 16XSR-36S | A0600HI016AALPGF0182 | A0600HI016AALPGF0187 | 0.60mm(.0236in)Pitch,Receptacle IDC Connectors,Socket,16 Circuits,Gold(Au) Plating,UL 94V-0,Black | ||
| JST | SM02B-XSRS-ETB(LF)(SN) | SM02B-XSRS-ETB(LF)(SN) | SM2B-XSRS-ETB(LF)(SN) | A0600RS002AALPGFB0182 | A0600RS002AALPGFB0109 | 0.60mm(.0236in)Pitch,Header,SMD,Right-Angle,2 Circuits,Gold(Au) Plating,UL 94V-0,Black |
| JST | SM03B-XSRS-ETB(LF)(SN) | SM03B-XSRS-ETB(LF)(SN) | SM3B-XSRS-ETB(LF)(SN) | A0600RS003AALPGFB0182 | A0600RS003AALPGFB0109 | 0.60mm(.0236in)Pitch,Header,SMD,Right-Angle,3 Circuits,Gold(Au) Plating,UL 94V-0,Black |
| JST | SM04B-XSRS-ETB(LF)(SN) | SM04B-XSRS-ETB(LF)(SN) | SM4B-XSRS-ETB(LF)(SN) | A0600RS004AALPGFB0182 | A0600RS004AALPGFB0109 | 0.60mm(.0236in)Pitch,Header,SMD,Right-Angle,4 Circuits,Gold(Au) Plating,UL 94V-0,Black |
| JST | SM05B-XSRS-ETB(LF)(SN) | SM05B-XSRS-ETB(LF)(SN) | SM5B-XSRS-ETB(LF)(SN) | A0600RS005AALPGFB0182 | A0600RS005AALPGFB0109 | 0.60mm(.0236in)Pitch,Header,SMD,Right-Angle,5 Circuits,Gold(Au) Plating,UL 94V-0,Black |
| JST | SM06B-XSRS-ETB(LF)(SN) | SM06B-XSRS-ETB(LF)(SN) | SM6B-XSRS-ETB(LF)(SN) | A0600RS006AALPGFB0182 | A0600RS006AALPGFB0109 | 0.60mm(.0236in)Pitch,Header,SMD,Right-Angle,6 Circuits,Gold(Au) Plating,UL 94V-0,Black |
| JST | SM07B-XSRS-ETB(LF)(SN) | SM07B-XSRS-ETB(LF)(SN) | SM7B-XSRS-ETB(LF)(SN) | A0600RS007AALPGFB0182 | A0600RS007AALPGFB0109 | 0.60mm(.0236in)Pitch,Header,SMD,Right-Angle,7 Circuits,Gold(Au) Plating,UL 94V-0,Black |
| JST | SM08B-XSRS-ETB(LF)(SN) | SM08B-XSRS-ETB(LF)(SN) | SM8B-XSRS-ETB(LF)(SN) | A0600RS008AALPGFB0182 | A0600RS008AALPGFB0109 | 0.60mm(.0236in)Pitch,Header,SMD,Right-Angle,8 Circuits,Gold(Au) Plating,UL 94V-0,Black |
| JST | SM09B-XSRS-ETB(LF)(SN) | SM09B-XSRS-ETB(LF)(SN) | SM9B-XSRS-ETB(LF)(SN) | A0600RS009AALPGFB0182 | A0600RS009AALPGFB0109 | 0.60mm(.0236in)Pitch,Header,SMD,Right-Angle,9 Circuits,Gold(Au) Plating,UL 94V-0,Black |
| JST | SM10B-XSRS-ETB(LF)(SN) | SM10B-XSRS-ETB(LF)(SN) | A0600RS010AALPGFB0182 | A0600RS010AALPGFB0109 | 0.60mm(.0236in)Pitch,Header,SMD,Right-Angle,10 Circuits,Gold(Au) Plating,UL 94V-0,Black | |
| JST | SM12B-XSRS-ETB(LF)(SN) | SM12B-XSRS-ETB(LF)(SN) | A0600RS012AALPGFB0182 | A0600RS012AALPGFB0109 | 0.60mm(.0236in)Pitch,Header,SMD,Right-Angle,12 Circuits,Gold(Au) Plating,UL 94V-0,Black | |
| JST | SM14B-XSRS-ETB(LF)(SN) | SM14B-XSRS-ETB(LF)(SN) | A0600RS014AALPGFB0182 | A0600RS014AALPGFB0109 | 0.60mm(.0236in)Pitch,Header,SMD,Right-Angle,14 Circuits,Gold(Au) Plating,UL 94V-0,Black | |
| JST | SM16B-XSRS-ETB(LF)(SN) | SM16B-XSRS-ETB(LF)(SN) | A0600RS016AALPGFB0182 | A0600RS016AALPGFB0109 | 0.60mm(.0236in)Pitch,Header,SMD,Right-Angle,16 Circuits,Gold(Au) Plating,UL 94V-0,Black |
Key Features
Space-Saving Right-Angle Design:
Side-entry mating helps keep the connector profile close to the PCB, suitable for compact boards and space-constrained device layouts.
SMT Production Compatibility:
Surface-mount construction supports automated PCB assembly, with tape-and-reel packaging available for placement equipment.
JST XSR Alternative:
Selected XSR models can be evaluated against the corresponding CSG configuration by circuit count, dimensions and PCB footprint.
Fine-Pitch PCB Integration:
0.60 mm pitch and single-row construction suit compact wire-to-board interfaces used in small electronic modules and consumer devices.
Applications
Wearable Devices: Display, sensor and control-board connections in smart watches, fitness trackers and compact wearable devices.
Portable Electronics: Internal PCB connections for cameras, handheld displays, speakers and compact control modules.
Smart Home Devices: Connections between main control boards and sensors, displays or user-interface modules in compact appliances.
Communication Devices: Board-to-wire connections for wireless modules, antenna-related circuits and compact communication equipment.
Measurement Equipment: Connections for sensors, displays and control circuits in portable test and measurement instruments.
Material & Contact Finish
Housing Material: Black LCP (Liquid Crystal Polymer), UL94V-0 flame-retardant grade.
Terminal & Pin Material: Phosphor copper terminals and pins for the specified contact geometry and connector structure.
Contact Plating: Gold (Au) plating is applied to the specified contact surfaces.
Grounding Tab Finish: Phosphor copper grounding components with tin plating.
Customization Support
Available circuit positions can be selected from the listed configurations according to the required part number and PCB design.
Contact finish requirements can be reviewed for specific OEM applications.
Customer part numbers, product labels and packaging identification can be arranged.
Housing dimensions, terminal finish and structural requirements can be reviewed from drawings, samples or reference parts.
Mating Connector & Compatibility
Mating Interface: Designed for 0.60mm pitch side-entry wire-to-board connections with the corresponding XSR-series receptacle.
Reference Compatibility: Available as an alternative for selected JST XSR header models, subject to circuit count and dimensional verification.
Fit Verification: Mating dimensions, PCB footprint, contact position and connector height can be checked against the reference part before approval.
Manufacturing Capability
Precision Tooling:
Mold design and precision tooling support 0.60 mm-pitch LCP housings and fine-pitch connector structures.
Precision Stamping & Molding:
Phosphor copper terminals are stamped and formed, while LCP housings are injection molded according to specified connector dimensions.
Automated Assembly:
Connector components can be assembled and supplied in tape-and-reel formats for automated SMT placement and recurring production orders.
Reliability Testing:
Temperature cycling, salt spray, contact resistance and mating durability tests can be arranged according to applicable product or customer requirements.
Solderability Testing:
SMT terminals can be evaluated for solder wetting and joint formation under the specified assembly process.
FAQ
Q: Can you provide samples before mass production?
A: Samples can be provided for dimensional, mating, PCB footprint and SMT assembly evaluation before mass production.
Q: Can this connector replace JST XSR directly?
A: It can be evaluated as an alternative to selected JST XSR models. Circuit count, dimensions, mating interface and PCB footprint should be verified against the reference part before approval.
Q: Do you support custom circuit counts?
A: Custom circuit counts can be reviewed based on the required connector dimensions, tooling and production quantity.
Q: What is your MOQ for OEM orders?
A: MOQ depends on the selected configuration, tooling requirements and order quantity. Existing configurations may require different minimum quantities from new tooling projects.
Q: Can you provide PPAP or inspection reports?
A: Inspection reports and applicable quality documents can be provided according to project requirements. PPAP documentation can be discussed for qualified OEM programs.
Q: How do you ensure batch consistency?
A: Production batches are controlled against approved drawings, materials and process requirements, with inspection records retained for product and batch identification.
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